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NSQA6V8AW5T2 Series Low Capacitance Quad Array for ESD Protection
This integrated transient voltage suppressor device (TVS) is designed for applications requiring transient overvoltage protection. It is intended for use in sensitive equipment such as computers, printers, business machines, communication systems, medical equipment, and other applications. Its integrated design provides very effective and reliable protection for four separate lines using only one package. These devices are ideal for situations where board space is at a premium.
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1 2 3 4 5
* ESD Protection: IEC61000-4-2: Level 4 * * * * * *
MILSTD 883C - Method 3015-6: Class 3 Four Separate Unidirectional Configurations for Protection Low Leakage Current < 1 mA Power Dissipation: 380 mW Small SC-88A SMT Package Low Capacitance Pb-Free Package is Available
SC-88A/SOT-323 CASE 419A
MARKING DIAGRAM
4 5 6x MG G 1 x 2 3
Benefits
* Provides Protection for ESD Industry Standards: IEC 61000, HBM * Minimize Power Consumption of the System * Minimize PCB Board Space
Typical Applications
* * * * *
Instrumentation Equipment Serial and Parallel Ports Microprocessor Based Equipment Notebooks, Desktops, Servers Cellular and Portable Equipment
= H for NSQA6V8AW5T2 X for NSQA12VAW5T2 M = Date Code G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
Device NSQA6V8AW5T2 NSQA6V8AW5T2G Package SC-88A Shipping 3000/Tape & Reel
SC-88A 3000/Tape & Reel (Pb-Free) SC-88A 3000/Tape & Reel
NSQA12VAW5T2 NSQA12VAW5T2G
SC-88A 3000/Tape & Reel (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2006
1
December, 2006 - Rev. 4
Publication Order Number: NSQA6V8AW5T2/D
NSQA6V8AW5T2 Series
MAXIMUM RATINGS (TA = 25C unless otherwise noted)
Rating Peak Power Dissipation 8 20 msec Double Exponential Waveform (Note 1) Steady State Power - 1 Diode (Note 2) Thermal Resistance - Junction-to-Ambient Above 25C, Derate Operating Junction Temperature Range Storage Temperature Range Lead Solder Temperature - Maximum 10 Seconds Duration Symbol PPK PD RqJA 327 3.05 TJ Tstg TL -40 to +125 -55 to +150 260 Value 20 380 Unit W mW C/W mW/C C C C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non-repetitive current pulse per Figure 1. 2. Only 1 diode under power. For all 4 diodes under power, PD will be 25%. Mounted on FR4 board with min pad.
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) NSQA6V8AW5T2
Characteristic Breakdown Voltage (IT = 1 mA) (Note 3) Leakage Current (VRWM = 5.0 V) Clamping Voltage 1 (IPP = 1.6 A, 8 Maximum Peak Pulse Current (8 20 msec Waveform) 20 msec Waveform) Symbol VBR IR VC IPP CJ Min 6.4 - - - - - Typ 6.8 - - - 12 6.7 Max 7.1 1.0 13 1.6 15 9.5 Unit V mA V A pF
Junction Capacitance - (VR = 0 V, f = 1 MHz) - (VR = 3.0 V, f = 1 MHz)
NSQA12VAW5T2
Breakdown Voltage (IT = 5 mA) (Note 3) Leakage Current (VRWM = 9.0 V) Zener Impedence (IT = 5 mA) Clamping Voltage 1 (IPP = 0.9 A, 8 Maximum Peak Pulse Current (8 20 msec Waveform) 20 msec Waveform) VBR IR ZZ VC IPP CJ 11.4 - - - - - 12.0 - - - - - 12.7 0.05 30 23 0.9 15 V mA W V A pF
Junction Capacitance - (VR = 0 V, f = 1 MHz) 3. VBR is measured at pulse test current IT.
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NSQA6V8AW5T2 Series
100 Ppk, PEAK SURGE POWER (W) % OF RATED POWER OR IPP 110 100 90 80 70 60 50 40 30 20 10 0
10
1
1
10 t, TIME (ms)
100
1000
0
25
50
75
100
125
150
TA, AMBIENT TEMPERATURE (C)
Figure 1. Pulse Width
Figure 2. Power Derating Curve
0.16 TYPICAL CAPACITANCE (pF) 1 MHz FREQUENCY IR, REVERSE LEAKAGE (mA) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0 -60 -40 -20 0 20 40 60 80 100 T, TEMPERATURE (C)
14 12 10 8 6V 6 4 2 0 0 1 2 3 4 5 6 BIAS VOLTAGE (V) 12 V TA = 25C
Figure 3. Reverse Leakage versus Temperature
Figure 4. Capacitance
100 % OF PEAK PULSE CURRENT 90 80 70 60 50 40 30 20 10 0
tr
PEAK VALUE IRSM @ 8 ms PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms HALF VALUE IRSM/2 @ 20 ms IF, FORWARD CURRENT (A)
1
0.1
0.01
tP
TA = 25C 0.001 0 20 40 t, TIME (ms) 60 80 0.6 0.8 1.0 1.2 1.4 1.6 1.8 VF, FORWARD VOLTAGE (V)
Figure 5. 8 x 20 ms Pulse Waveform
Figure 6. Forward Voltage
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NSQA6V8AW5T2 Series
PACKAGE DIMENSIONS
SC-88A/SOT-323/SC-70 5-LEAD PACKAGE CASE 419A-02 ISSUE J
G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM A B C D G H J K N S INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
A
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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NSQA6V8AW5T2/D

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